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TECHNOLOGY CAPABILIGY
| Items | Mass Production | Prototype | |
| Layers | 2-32L | 40L | |
| Max Board Thickness | 8.50mm | 9.00mm | |
| Min. Width/Spacing | Lnner Layer | 2.5mil/2.5mil | 2.2mil/2.2mil |
| Outer layer | 3mil/3mil | 2.5mil/2.5mil | |
| Registration | Layer to Layer | ±25um | ±20um |
| Layer to Layer | ±5um | ±4um | |
| Max. Copper Thickness | 6Oz | 10Oz | |
| Min. Drill Hole Dlameter | Mechanical | ≥0.15mm(6mil) | ≥0.1mm(4mil) |
| Laser | 0.1mm（4mil） | 0.075mm（3mil） | |
| Max. Size (Finish Size) | 850mmX570mm | 1000mmX600mm | |
| Aspect Ratio (Finish Hole) | 10:1 | 14:1 | |
| Material | FR4 | 370HR,EM827, S1000-2, IT180A, EM825, IT158, S1000 S1155, R1566W, EM285, TU862HF | |
| High Speed | M6, M4, M7,TU872SLK, FR408HR,N4000-13 Series,MW4000,MW2000,TU933 | ||
| High Frequency | Rogers serials,Ro3003, Ro3006, Ro4350B, Ro4360G2, Ro4835, CLTE, Genclad, RF35, FastRise27 | ||
| Others | Polyimide, Tk, LCP, BT, C-ply, Fradflex, Omega , ZBC2000, | ||
| Surface Finish | LEAD FREE HASL, ENIG, Immersion Tin, OSP, Immersion Silve, Gold Finger, Electroplating Hard Gold/Soft Gold, Selective OSP，ENEPIG | ||
TECHNOLOGY CAPABILIGY
| Items | Mass Production | Prototype | |
| Layers | 2-32L | 40L | |
| Max Board Thickness | 8.50mm | 9.00mm | |
| Min. Width/Spacing | Lnner Layer | 2.5mil/2.5mil | 2.2mil/2.2mil |
| Outer layer | 3mil/3mil | 2.5mil/2.5mil | |
| Registration | Layer to Layer | ±25um | ±20um |
| Layer to Layer | ±5um | ±4um | |
| Max. Copper Thickness | 6Oz | 10Oz | |
| Min. Drill Hole Dlameter | Mechanical | ≥0.15mm(6mil) | ≥0.1mm(4mil) |
| Laser | 0.1mm（4mil） | 0.075mm（3mil） | |
| Max. Size (Finish Size) | 850mmX570mm | 1000mmX600mm | |
| Aspect Ratio (Finish Hole) | 10:1 | 14:1 | |
| Material | FR4 | 370HR,EM827, S1000-2, IT180A, EM825, IT158, S1000 S1155, R1566W, EM285, TU862HF | |
| High Speed | M6, M4, M7,TU872SLK, FR408HR,N4000-13 Series,MW4000,MW2000,TU933 | ||
| High Frequency | Rogers serials,Ro3003, Ro3006, Ro4350B, Ro4360G2, Ro4835, CLTE, Genclad, RF35, FastRise27 | ||
| Others | Polyimide, Tk, LCP, BT, C-ply, Fradflex, Omega , ZBC2000, | ||
| Surface Finish | LEAD FREE HASL, ENIG, Immersion Tin, OSP, Immersion Silve, Gold Finger, Electroplating Hard Gold/Soft Gold, Selective OSP，ENEPIG | ||
