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FEATURES
· Excellent reliability
· Light and thin, helping reducing the size and weight of electronic products
· High wiring density
· Free bending, winding, and folding
· High flexibility
· Excellent heat dissipation
· Excellent solderability
TECHNOLOGY CAPABILIGY
| Layer Count | 1-12L |
| Material | PI, LCP, PTFE |
| Finished Board Thickness | 0.10mm-1.00mm |
| Max Board Size | 220mm x 558.00mm |
| Min Bending radius | 3-5 times board thickness |
| Line Width/Space | 2mil/2mil |
| Dimension Tolerance | +/-0.05mm |
FEATURES
· Excellent reliability
· Light and thin, helping reducing the size and weight of electronic products
· High wiring density
· Free bending, winding, and folding
· High flexibility
· Excellent heat dissipation
· Excellent solderability
TECHNOLOGY CAPABILIGY
| Layer Count | 1-12L |
| Material | PI, LCP, PTFE |
| Finished Board Thickness | 0.10mm-1.00mm |
| Max Board Size | 220mm x 558.00mm |
| Min Bending radius | 3-5 times board thickness |
| Line Width/Space | 2mil/2mil |
| Dimension Tolerance | +/-0.05mm |
